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THE CHALLENGE: A concrete ceiling over an underground channel carrying a large volume of wood chips in hot, 180°F aqueous adhesive solution had been attacked by hot acid condensation over a period of years. The wood chips were carried to a filter press, which formed them into particleboard. Because the concrete ceiling was in such a deteriorated condition aggregate occasionally fell into the wood chip stream resulting in unacceptable inclusions in the particleboard which would either damage the manufacturing equipment or dull saw blades. A system was required to reinforce and encapsulate the deteriorated ceiling, which could be installed over a 5-day holiday shutdown.
THE SOLUTION: A novel lightweight fairing compound designated BIO-FILL™ 456 was especially formulated for this application. This compound is based on inert lightweight pigmentation and a combination of BisA and BisF epoxy resins cured by the proprietary TFT curing system. BIO-FILL™ 456 is surface tolerant, chemical and heat resistant and capable of ½” applications on overhead and vertical surfaces.
After sandblasting to remove loose surface deposits, the exposed aggregate and mortar was primed with a sprayed application of BIO-SEAL™ 196 low viscosity, 100% solids epoxy sealer. This sealer reinforced the remaining surface mortar and aggregate and assisted the overhead application of the BIO-FILL™ 456 by providing a fresh organic surface.
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Two gallons of black curing agent were stirred into two gallons of white epoxy base to yield four gallons of mixed BIO-FILL™ 456 using a ½” Jiffy type mixer. The mixed material was applied overhead to over a thousand square feet of channel ceiling at ½” thickness using trowel or
"pool-float" type applicators. A glaze coat of BIO-GARD™ 258, 100% solids Kevlar™ epoxy coating was applied by roller at about 16 mils film thickness.
RESULT: A smooth, permanent encapsulation of the channel ceiling has been made in just a few days, which will prevent future product contamination at the fiberboard mill.
For more information contact:
Jeff Longmore, Technical Director
Thin Film Technology, Inc.
P.O. Box 580669
Houston TX 77258-0669
Phone: (713) 910-6200
Fax: (713) 910-6210
Email: jeff@thinfilmtech.net
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